The Computer-on-Module industry is about to launch a new product lifecycle that will create a new performance class after ETX/XTX and COM Express. Called COM-HPC, the new form factor standard is currently primed for PICMG certification by companies such as congatec. Ultra-fast real-time data exchange will be a major application field due to 5G network rollout. But users of preceding COM standards needn’t worry about the availability of their solutions, because every transition takes time and products based on existing standards will be on the market for many years to come.