- Published in issue 12/2016 on page 24
Panel Level Packaging
Vision and rationale for panel level packaging research
Embedding die technology has its roots in the chip-first technology of GE developed for special applications 40 years ago mainly by Ray Fillion. Over the last decade it has developed into two types: Embedding into PWB (embedded die) and reconfigured moulded wafer. FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and is already accounting for a market value of over 170 million USD due to the tremendous increase in hand-held applications. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduce the total form factor.