Company Description: 

We are offering adaptive electronic packaging which is the housing and connecting of integrated circuits. Whenever it comes to demands from the market for small lot sizes (several hundred or thousands), or quickly manufactured packages, our technology offers just the right advantage. Our aim at Micropack3D is enabling new generations of highly adapted and specialized electronics and shortening precious development time.

Video Pitch:

Country

Germany

Year Founded 

2020

Company Phase

Development & Production Phase

Please specify in what phase you are! 

We have found a few months ago and are selling to our first customer on a regular basis. We have developed a special package that is sold within a frame agreement. We are also within the last steps of our Seed Financing round and hope to close it at the beginning of next year.

Number of employees

1-5

Existing Sponsors & Partners

We are partnering with our pilot customer and are starting development with big semiconductor manufacturers. We are also partnering with companies to further develop our process.

Did you get funding?

Yes, Governmental & Organisations

Investment needed?

No, already funded

Milestones

We were awarded an EXIST Forschungstransfer and won 2nd price at last years productronica Fast Forward as well as this year's Embedded World

Website 

www.micropack3d.com


 

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