Infineon Technologies AG reports having expanded its XENSIV™ 3D magnetic sensor family TLx493D with a new device for industrial and consumer applications: the TLI493D-W2BW. It uses the latest 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46 percent less height than previous comparable products, the sensor opens up new design options.