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Rutronik Elektronische Bauelemente
Rutronik has grown from a one-man business into the third largest distributor in Europe and the eleventh largest worldwide. More than 1,700 employees generated...
Tag combinations: Sensors IoT Bluetooth Wireless Wearables Audio Prototyping RF USB Measurement Components ESD Electric vehicle DC Battery SoC transceiver Radio Laser Antenna memory RAM CMOS Power Electronics MCU Measuring Network MOSFET Power Supply Cables Connectors Development Platform Panasonic acoustics Elektor Business newsroom PCIM DRAM e-mobility Elektor Industry IT equipment CSR Hearables Redpine Distributor
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Rutronik at embedded world 2020
December 12, 2019 by Rutronik Elektronische Bauelemente GmbH

Rutronik at embedded world 2020

This is a submission from Rutronik. Their appearance at embedded world 2020 in Nuremberg (Germany), will be centered around new Bluetooth standards, IoT and 5G applications, and display technologies.
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New at Rutronik: Half-Brick DC/DC Converter with Buck-Boost Topology from Recom
December 10, 2019 by Rutronik Elektronische Bauelemente GmbH

New at Rutronik: Half-Brick DC/DC Converter with Buck-Boost Topology from Recom

This is a submission from Rutronik on the Recom buck-boost converter RBBA30. In a half-brick package it delivers up to 3kW output power with a conversion efficiency of 98%. It is baseplate-cooled and allows individual programming of the output voltage and the maximum current. The RBBA3000 is available at Rutronik now.
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JAE Once Again Names Rutronik “EMEA Distributor of the Year”
December 3, 2019 by Rutronik Elektronische Bauelemente GmbH

JAE Once Again Names Rutronik “EMEA Distributor of the Year”

This is a submission from Rutronik. The distributor earned the title of “EMEA Distributor of the Year” from JAE, the Japanese manufacturer of connectors and cable assemblies, for the second year in a row. JAE’s high-precision connector solutions are used primarily in IoT, factory automation, telecommunications, medical equipment, consumer goods, and automotive applications.
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Preview Development Kit for Dual Processor SoC nRF5340 from Nordic at Rutronik
November 28, 2019 by Rutronik Elektronische Bauelemente GmbH

Preview Development Kit for Dual Processor SoC nRF5340 from Nordic at Rutronik

This is a submission from Rutronik on the Nordic Semiconductor dual processor SoC (System on Chip) nRF5340. With the Preview Development Kit (PDK) developers can already test and evaluate designs based on the SoC.
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Rutronik and HMS Industrial Networks Sign Global Distribution Agreement
November 26, 2019 by Rutronik Elektronische Bauelemente GmbH

Rutronik and HMS Industrial Networks Sign Global Distribution Agreement

This is a submission from Rutronik. The company is expanding its portfolio with products from HMS Industrial Networks, a manufacturer of solutions for industrial communication and the Internet of Things. The companies have entered into a global distribution agreement.
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At Rutronik: Nordic’s Newest Multiprotocol SoC nRF52833 & Development Kit
November 13, 2019 by Rutronik Elektronische Bauelemente GmbH

At Rutronik: Nordic’s Newest Multiprotocol SoC nRF52833 & Development Kit

This is a submission from on new Nordic Semiconductor multiprotocol SoC (System on Chip) nRF52833. It supports Bluetooth 5.1, Bluetooth Mesh, 802.15.4, Thread, ZigBee and proprietary 2,4GHz protocols. For developments based on the nRF52833 there is also a flexible single-board Development Kit (DK) available.
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Available at Rutronik: USB Type-CTM compatible I/O Connectors from JAE
October 23, 2019 by Rutronik Elektronische Bauelemente GmbH

Available at Rutronik: USB Type-CTM compatible I/O Connectors from JAE

This is a submission from Rutronik on JAE‘s (Japan Aviation Electronics) DX07 Series USB Type-CTM compatible I/O (DX07) connectors. These are compatible with the newest USB specification and are ideal as new standard interface for different applications. With USB 3.2 and USB Power Delivery, they provide a broad usability.
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Rutronik presents Panasonic’s compact Bluetooth Dual-Mode HCI Module
October 10, 2019 by Rutronik Elektronische Bauelemente GmbH

Rutronik presents Panasonic’s compact Bluetooth Dual-Mode HCI Module

This is a submission from Rutronik on the Panasonic HCI (Host Controlled Interface) Bluetooth RF module PAN1326C2. It's based on Texas Instruments’ CC2564C dual-mode Bluetooth controller that combines Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE). The module supports up to ten BLE connections at the same time - thanks to independent buffering for LE without affecting the BR or EDR performance.
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Rutronik and Laser Components Sign Global Distribution Agreement
October 9, 2019 by Rutronik Elektronische Bauelemente GmbH

Rutronik and Laser Components Sign Global Distribution Agreement

This is a submission from Rutronik on their global distribution agreement with Laser Components GmbH. Laser Components’ product range includes photodiodes, IR components, lasers, laser modules, fiber optics, and optical components. These products are used in a wide variety of industrial applications, primarily for positioning and marking in the medical, industrial, and laser systems sectors.
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At Rutronik: Infineon Wideband RF Switches with High Switching Speed
September 27, 2019 by Rutronik Elektronische Bauelemente GmbH

At Rutronik: Infineon Wideband RF Switches with High Switching Speed

This is a submission from Rutronik on the wideband RF diversity switches BGS14WMA9 and BGS12WN6 with high switching speed and optimized for WLAN and Bluetooth applications. They offer wideband support with 0.05 to 6.0GHz coverage for FM Radio, LTE, LAA and 5G applications.
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