- Published in issue 10/2019 on page 19
Almit‘s Worldwide Innovation: MR-NH
Small area ratio, big performance
In the automotive sector, electronics is more frequently directly placed at the power unit, forcing downsizing of the control units. Moreover, in module design, a high mix of module sizes can be found more and more frequently. To guarantee a sufficient amount of solder paste for bigger modules, metal stencils with a thickness of up to 150 µm are used for these applications.