A New Multilayer Process For Integrated Passive Devices

14 EE P p 1988 A NEW MULTILAYER PROCESS FOR INTEGRATED PASSIVE DEVICES by Dr. Gordon R. Love Introduction 1 This article describes a new process, derived from techniques used to produce multilayer ceramic capacitors, which is the key to a technique, known as Multilythics®, allowing complex integrated multi-functional passive circuits to be produced. There are two fundamentally different build-up processes for multilayer cer- amic devices or assemblies. Each begins with a slip of finely divided ceramic par- ticles dispersed and suspended in a com- plex organic system. In the more com- monly used process, this slip is cast in thin sheets of controlled thickness and dried; patterns are then printed on it by thick-film silk-screen processing, and the array of finished devices is assembled by stacking and laminating these single sheets. This process is generally known as dry stack or "tape" manufacturing. The alternative process involves casting the slip onto an inert carrier, drying ...