Infrared Reflow Oven T-962
Features
Large infrared soldering area
Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment.
Choice of different soldering cycles
Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
Special heat up and temperature equalization with all designs
Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T-962 to be easily bench positioned transported or stored.
Large number of available funtions
The T-962 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Specifications
| Max. soldering area | 180 x 235 mm (7.1 x 9.3')
| Rated power | 800 W
| Processing time | 1~8 minutes
| Power supply | 220 V AC/60 Hz
| Dimensions | 31 x 29 x 17 cm (12.2 x 11.4 x 6.7')
| Weight | 6.2 kg
