A new chip from NXP can boost the output power of micro speakers by more than five times, vastly improving the sound quality of mobile devices. By driving over 2.6 watts RMS into micro speakers that have previously been limited to 0.5 W, the TFA9887 IC will give mobile phones, portable music players and tablets much louder sound, deeper bass, and higher sound quality without risking speaker damage.
Adaptive excursion control measures the actual excursion of the speaker membrane to ensure that it never exceeds its rated limit. Real-time temperature protection measures the voice-coil temperature directly to prevent thermal damage. An advanced clip avoidance algorithm monitors audio performance and prevents clipping, even when the power supply begins to sag. Bandwidth extension increases the low frequency response well below speaker resonance. And an intelligent DC-to-DC boost converter maximizes audio headroom from any supply level despite battery undervoltage. The chip automatically adapts to any changes in the speaker – including ageing, damage to the enclosure, and blocked speaker ports – helping to optimize performance and maintain the desired sound quality.
See it on Video