Features Overview
 
Panasonic's new "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" has the following features:
  • The industry's first halogen-free multi-layer circuit board material for RF power amplifiers achieves low transmission losses in the high-frequency range, enabling compact-sizing of wireless base stations.
  • Transmission loss at 20 GHz: -20 dB/m
  •  Its high thermal conductivity effectively dissipates heat from heated components used on the power amplifier to provide reliable operation.
  • Thermal conductivity: 0.6 W/(m·K) (1.5 times that of the Panasonic's conventional product)
  • The material protects against deterioration of transmission characteristics in high-temperature environments, thereby contributing to the long-term durability of the base stations.
  • Dielectric constant change rate: 1.0%, Dissipation factor change rate: 3.5% (1000 hours at 125°C)
  • Dielectric constant change rate of current products: 3.0%, Dissipation factor change rate of current products: 80% (1000 hours at 125°C)
 
 
Suitable applications include circuit board for power amplifiers (for wireless base stations, small cell use), etc.
 
Product Features in Detail
 
1. The industry's first halogen-free multi-layer board material for RF power amplifiers, achieving low transmission loss for contributing to compact-sizing of wireless base stations
 
Previous circuit board materials for RF power amplifiers were produced primarily with a double-sided structure and they were not designed with a multi-layer structure in mind. With communication systems becoming ever more compact, the adoption of small cells and smaller board areas is necessary, so multi-layer designs are increasingly being adopted. From an environmental viewpoint, halogen-free materials are ideal; however, alternative non-halogen flame retardant component structures tend to show considerable transmission loss in the high frequency range. Panasonic by applying its proprietary resin design technology, has commercialized the industry's first halogen-free multi-layer board material for RF power amplifiers that is flame retardant and has low transmission loss in the high frequency range, which were difficult in the past. By achieving a multi-layer structure of 10 layers or so, usable for high-speed communication in the milliwave band of 20 - 80 GHz, it is expected to contribute to compact-sizing of wireless base stations and the achievement of 5G mobile communication systems.