2. High thermal conductivity effectively dissipates heat from heat-generating components on the power amplifier board, thereby contributing to reliable operation.
 
Small cells consist of high heat generating components mounted on a relatively small electronic circuit board. Use of conventional board materials would cause the heat-generating components to become extremely hot, increasing the risk of operational instability and failure. Because R-5575 employs a highly thermally conductive resin design that disperses and dissipates the heat generated by components, temperatures can be kept low, therefore achieving stable operation of communication base stations.
 
3. The material contributes to the long-term operation of base stations by suppressing the deterioration of transmission characteristics that tends to occur under high-temperature conditions.
 
Board materials for RF power amplifiers used to be subject to the problem of deteriorating transmission characteristics when used for many hours in a high-temperature environment because they are made from resin. Panasonic's proprietary resin technology that is used in R-5575 successfully minimizes any deterioration in dielectric constant and dissipation factor even during extended use at high temperatures. This feature is expected to preserve stable transmission characteristics and contribute to the long-term stable operation of communication base stations.

Product information:
https://industrial.panasonic.com/ww/products/electronic-materials/circuit-board-materials/low-loss/llossr5575?ad=press20170601