ABOUT CATEGORY Components

The parts that are used to create electronics devices and circuits. Common components used in electronics are the resistor, capacitor, inductor, diode, transistor, and the integrated circuit. Electromechanical devices like switches, relays, connectors, and enclosures are also considered components.

MOSFET Components STMicroelectronics Microchip Elektor Business Panasonic Electric Works Medical Magnetic Mouser IIOM obsolete Trinamic Motion Control newsroom Sensors IoT Obsolescence Toshiba Texas Instruments Capacitors ESD Smartphone Microcontrollers Transistors FPGA LED Editorial Automotive Analog Devices Schurter AG Elektor.LABS TDK memory Array FET Motion Controller Acme Corporaton Trinamic Wearables Review Semiconductors Energy USB AMS Low-power Battery MEMS module stepper motor EEPROM Infineon ARM Kickstarter Linear Technology Power Modules Wireless Power Supplies Voltage Regulators Nano technology Op-Amps OS Windows Contactless Medical and Healthcare (including Wearables) Laser China Education IBM IC Switch SMD Vishay würth Elektronik Connectors Memristor Nexperia chips Diodes GPS Raspberry Pi Intel Samsung PCB Design I2C Retronics Gordon Moore Amplifier NXP Semiconductors Synthesizer Prototyping Altera RF NFC Heat Dissipation Lighting Takeover SoC Hall effect IMEC Silicon Labs Renesas Analog circuit design Diode relay Fujitsu PIC RAM CIP Power Electromotor Flash Graphene High Voltage Piëzo Silicon CAN oscillator ULN2003 Littelfuse Power Supply Gyroscope Cables wireless power Qualcomm Wolfspeed Harwin Counterfeiting Talking Heads Caltech Resistor swissbit rutronik Arduino Free Article Atmel Elektor Store Freescale Drones AG Robotics Bluetooth Audio Elektor.TV Engine 3D Artificial Intelligence Genuino Circuit Design DARPA Tubes Development Boards Voice Recognition Software Defined Radio USB 3 Books Congatec ZigBee Nordic Semiconductor Security Open Source New Materials Indiegogo Measurement OSRAM MIPS Galvanic isolation Brussels Antitrust Regulations European Commission Pooling Smart Card TruTag Tektronix interface Robots Class-D Ultra-thin Melexis Magnetoresistive FTDI gernanium Automation Accelerometer ASIL Maxim OKW Unitec Enclosure Battery compartment Dual face Oslux IR LED Iris scanner Nanostack Break out Boards Integrated Distance sensors bulb incandescent Chip Globalfoundries research Smartphones Antenna Display Aluminium Camera Circuit Controller Converter Design e-paper Galileo inductive book Time miniature Rohm transmitter u-blox GNSS eCall Satnav DC-DC Converter FinFET Pi Zero Reichelt RS232 CMOS EUV Keysight ON Semiconductor AC line frequency Power factor Image Sensors Biosensor BLDC Motor Electronics Fairchild Isolators MCU Microcontroller Microphone Molecule Xilinx Stanford University Temperature sensor Mitsubishi Scattered light Dust Pollen Photodetector serial photodiode preamp speed Clock servo colour SMPS ADC logic low-noise switch-mode Wurth Current Lumileds GBW BiCMOS Rail-to-rail Copal Flexible electronics electronica High frequency Buck Fast Forward Start-up Award Avnet Silica Industry 4.0 LTC Internet of Things Lattice Semiconductor Energy harvesting Switching frequency WiTricity CAN FD Elektor International Media USB-C Video Bluetooth 5 Arduino Shield Intersil RERAM Centronics Electrolytic capacitor Cree LEM Voltera Renesas Electronics Europe Marketing stm Simulation Infineon Technologies component Actuators space Resistance NSE Rigado System-on-Module Control PLD Taiyo Yuden photo control BC547 TUP TUN Embedded TT Electronics IQD Driver RTS UnitedSiC SiC Silicon Carbide Analogue Red Expert New Scale Technologies EDA SnapEDA Radio Controlli Redpine

All items in category Components

Infineon's CEO Reinhard Ploss

June 3, 2019 by Thomas Scherer

Infineon Moves on Cypress

The German chip manufacturer Infineon has announced its intention to acquire its American competitor Cypress Semiconductors. The acquisition will strengthen Infineon’s portfolio of interface technology for emerging applications in the automotive sector and the IoT...

Redpine Signals‘ Multiprotocol Wireless SoCs and Modules at Rutronik

May 27, 2019 by Rutronik Elektronische Bauelemente GmbH

Redpine Signals‘ Multiprotocol Wireless SoCs and Modules at Rutronik

This is a submission from Rutronik about the ultra-low power multi-protocol wireless SoCs and modules of Redpine Signals’ RS9116 family. The RS9116 family is featuring an internal protocol arbitration manager, who manages the protocols dual band (2.4 and 5GHz) 802.11 a/b/g/n, 802.11j, dual-mode Bluetooth 5 and 802.15.4 for Thread and ZigBee®.

New Piezo Actuators for Haptic Effects

May 16, 2019 by Thomas Scherer

New Piezo Actuators for Haptic Effects

TDK has expanded its range of Piezo Actuators in the PowerHap family of Haptic Feedback actuators with two rectangular devices which are just 9 mm and 12 mm in length. They are intended for use in the design of smartphones, tablets as well as professional portable devices.

Marko Milosevic, Product Sales Manager Connectors at Rutronik

April 29, 2019 by Rutronik Elektronische Bauelemente GmbH

Rutronik Significantly Expands Range of Molex Products

This is a submission from Rutronik Elektronische Bauelemente GmbH. The company has expanded its stock of top-selling products from the US connector and cable specialist Molex. As a result, customers will be able to obtain the right components for their project even more quickly and easily in the future.

NC-FET characteristics. Image: P. Ye, APL / Purdue University

March 21, 2019 by Thomas Scherer

Are NC-FETs the way forward?

Researchers at Purdue University think its time to make a comprehensive analysis of the existing data set of research into NC-FETs to focus on the way ahead.

Build electronics faster with a free InstaPart credit from SnapEDA!

Via: snapeda.com

Build electronics faster with a free InstaPart credit from SnapEDA!

SnapEDA is the biggest electronics parts library for circuit board design: they provide millions of free symbols and footprints to help you design electronics faster. If you need a part that isn't in their library yet, you can get it fast with InstaPart. Simply search for the part you need, request its symbol & footprint, and it'll be live in 24 hours. Redeem your free InstaPart credit now using code "makeitasnap".

Go to article...

Dual-channel FET driver achieves 1700 V isolation.

March 7, 2019 by Thomas Scherer

Gate-driver IC provides galvanic isolation

The STGAP2DM is the second FET dual-channel driver chip in the STGAP2 family from STMicroelectronics featuring galvanic isolation. It accepts low-voltage control inputs to drive two isolated output channels. The two channels can be used for both unipolar and bipolar gate control...

5-sensor temperature-supervisor chip runs at 1.8 V

January 22, 2019 by Thomas Scherer

5-sensor temperature-supervisor chip runs at 1.8 V

Microchip Technology has announced a family of five new temperature sensor management chips suitable for use with 1.8 V systems. The sensing elements — including one On-Chip-Sensor — are PN junctions which can be made from discrete transistors or from an integrated device forming part of a Field-Programmable Gate Array (FPGA), Graphics processor Unit (GPU) or a microcontroller etc...

A 3 V battery in SMD outline

January 18, 2019 by Thomas Scherer

Tiny SMD-outline battery

The Japanese component manufacturer FDK plans to begin shipping samples of its new, oxide-based SMD solid-state battery in February 2019. The cathode material of this tiny battery consists of lithium cobalt pyrophosphate, and was developed in association with Fujitsu Laboratories...

Phononics makes smaller mobile devices possible

January 4, 2019

Source: Caltech

Phononics makes smaller mobile devices possible

Modern mobile devices use components that use acoustic waves (vibrations) to filter or delay signals. The currently available components in this area (SAW-filters, Surface Acoustic Wave-filters) make further reductions in the size of mobile devices difficult, if not impossible, and furthermore have limitations as to the bandwidth that can be obtained.

«
1
2
3
4
5
6
7
8
...
32
33
»