In an attempt to prepare itself for 5G and IoT Qualcomm has signed a 3-billion dollar joint-venture agreement with TDK. The new company, RF360 Holdings, will provide a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in wireless communication networks.

TDK will bring its micro-acoustic RF filtering, packaging and module integration know-how to the deal, completing Qualcomm’s current RF360 portfolio of power amplifiers, antenna switches, antenna matching tuners, and envelope trackers.

Qualcomm will own 51 percent of the Singapore-based joint venture and TDK, through its Epcos subsidiary, will own 49 percent. Qualcomm has 30 months to buy out TDK’s stake.