Thin Film Electronics (Norway), a specialist in printed electronics, and Bemis (USA), a specialist in flexible packaging and pressure sensitive materials, have announced that they are joining forces to develop a flexible sensing platform for the packaging market. The result will be an innovative packaging solution that can collect and wirelessly communicate sensor information for use in the food, consumer products and healthcare sectors.
Building on current projects for developing inexpensive integrated time and temperature sensors for monitoring perishable goods and pharmaceutical products, Thin Film Electronics will extend the concept to create a customisable intelligent thin-film sensor platform. In turn, Bemis will tailor the platform to the individual requirements of its customers. The platform can be adapted to monitor and record key physical quantities and environmental data in packaged products.
The new platform is expected to be available in 2014.