| Intel is pairing EMIB technology with glass substrates to bypass the physical limits of standard AI chip packaging. This "thick-core" design...
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| As eeNews Europe reports, 2025 saw chip and EDA giants race to consolidate as next-gen AI data center silicon demanded new levels of power a...
| eeNews Europe reports that Deutsche Telekom and NVIDIA are building a sovereign “Industrial AI Cloud” in Germany to drive Europe’s next wave...
| On December 3, 2025, Elektor is hosting a conference focusing on post-quantum cryptography and its impact on embedded and IoT systems. Ahead...
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| Circularity and design-for-reuse have been niche concepts in electronics for many years. However, there is an increasing focus on the approa...
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| Supply chains are typically complex logistics systems that rely on entire ecosystems of suppliers, resources, skilled labour, and manufactur...
| Ahead of the Elektor online conference “Zephyr – The Open RTOS for Tomorrow’s Devices” on November 5, we spoke with inovex' Solution Archite...
| As AI accelerators drive rack power toward megawatt levels, engineers are reimagining data center power delivery. Nvidia’s new 800-V DC arch...
| In a recent conversation, Benjamin Cabé – Developer Advocate for the Zephyr project and speaker at Elektor’s upcoming online conference “Zep...
| France is backing a bold leap into space-based 5G with €31 million in CNES funding for UNIVITY and its groundbreaking VLEO satellite demonst...