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Modifying Stripboard for SO Packages

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Modifying Stripboard for SO Packages
This technique for modifying standard predrilled prototyping stripboard (‘perfboard’ or veroboard’) to accept SO IC packages is intended to be used for inexpensive breadboard constructions. It provides an economical alternative to using special circuit boards that accept SO packages and increase the lead spacing from 1.27 mm to the 2.54 mm grid spacing. The standard dimensions of SO and plastic DIP packages are shown for comparison with metric dimensions in parentheses.
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