Heatpipe adapter for COM Express heatspreader

The conga-B7E3/HPA heatpipe adapter absorbs the waste heat from the heatspreader via up to four heatpipes and directs it, for example, towards other passive heat sinks mounted on the housing. This allows the design of extremely powerful passively cooled systems for up to 100 Watt.
 

COM Express heatspreader with integrated heatpipe

The solution with integrated heatpipe, with the product name conga-B7E3/HSP-HP, was developed primarily for particularly flat embedded systems where a standard height COM Express heatspreader must be coupled to the housing. Here, the integrated heatpipe distributes the waste heat from the processor evenly over the entire heatspreader so that no hotspots are created, even in applications with a TDP of up to 100 Watt.
 

Active cooling system for rugged 24/7 operation

The fan-based active cooling system conga-B7E3/CSA-HP is specifically designed for 24/7 operation in harsh industrial environments. In this complete cooling system for COM Express Computer-on-Modules the fans are not only mounted extra securely, but also specifically fixed to reduce wear and tear. In addition, the bearings are equipped with a special seal and additional cover to provide maximum protection for mechanics and lubricant. With a high-performance synthetic oil as lubricant, the fan has an MTBF of several decades – and this in the industrial temperature range from -45 to +85°C and with industrial-grade shock and vibration resistance. The functional scope of this fan-based active cooling system is rounded off by the additional integration of a heatpipe to distribute the waste heat from the processor even before it reaches the active fan.

More information about congatec’s cooling solutions for the new 100 Watt ecosystem surrounding AMD EPYC Embedded Processor-based COM Express Computer-on-Modules can be found at: https://www.congatec.com/en/technologies/com-express/com-express-type-7/amd-epyc-embedded-3000-eco-system.html