At embedded world 2026, Brian Tristam Williams visits the Renesas booth for a look at Renesas 365, a cloud-based engineering platform designed to bring system design, hardware selection, software scaffolding, PCB development, and operational lifecycle management into one connected environment.

In this interview, Hooman Faroughi, VP of Application Engineering within Embedded Processing, and Leigh Gawn, VP of R&D in Digital Industries, explain how Renesas 365 is intended to help engineers deal with one of the oldest problems in embedded development: too many disconnected tools, workflows, and decisions spread across hardware, software, and system design.

The discussion covers:
  • Model-based search versus traditional parametric search
  • Automated microcontroller evaluation across the Renesas RA family
  • Real-time pin-mux and interface validation
  • Software project scaffolding based on design requirements
  • Board design integration
  • Connected product lifecycle management, including telemetry and firmware updates Renesas 365’s plans to expand the platform beyond RA MCUs and involve partners

Rather than acting as just another file repository or cloud IDE, Renesas 365 aims to represent engineering context in a way that helps developers move faster from concept to viable design.

Watch the video to learn more!
 
   
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