| Intel is pairing EMIB technology with glass substrates to bypass the physical limits of standard AI chip packaging. This "thick-core" design...
| Intel is pairing EMIB technology with glass substrates to bypass the physical limits of standard AI chip packaging. This "thick-core" design...
| Interested in computer vision? OpenMV embedded vision is the focus of Elektor Engineering Insights #57, featuring OpenMV President and Co-Fo...
| As eeNews Europe reports, 2025 saw chip and EDA giants race to consolidate as next-gen AI data center silicon demanded new levels of power a...
| Elektor is seeking presentations for its online conference on RISC-V on April 15, 2026. The call for presentations is open until January 16.
| As embedded and IoT systems grow more connected and critical, their security risks extend well beyond traditional software threats. This art...
| The Thundercomm Rubik Pi 3 combines Raspberry Pi-style usability with Qualcomm’s AI performance. Explore how this 12-TOPS SBC is reshaping m...
| The organizers at Elektor are seeking presentations for the online conference on RISC-V on April 15, 2026. The call for presentations is ope...
| The age of treating embedded security as a "nice to have" is officially over. Every network-connected device is now a security-relevant syst...
| Embedded Academy meets Elektor: 36 courses for developers and engineers – secure yours now with an Elektor discount!
| Modern Vision Language Models can now run on low-cost edge hardware like the RUBIK Pi 3. With its multiple accelerators, it can handle a VLM...