The latest MEMs device from STMicroelectronics is said to be the world's most advanced six-axis motion-sensor device designed to support image stabilization in smartphones, tablets and digital still cameras. The LSM6DS3H combines a 3-axis gyroscope and 3-axis accelerometer together with an Ultra Low Power processing IC to provide a System in Package using low power consumption and packaged in a LGA-14L 2.5 x 3.0 mm outline.

Key Features of the LSM6DS3H:

• Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
• “Always-on” experience with low power consumption for both accelerometer and gyroscope
• Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
• Auxiliary SPI (3-wire) to support OIS applications
• EIS/OIS support
• Accelerometer ODR up to 6.66 kHz
• Gyroscope ODR up to 3.33 kHz
• Smart FIFO
• ±2/±4/±8/±16 g full scale
• ±125/±245/±500/±1000/±2000 dps full scale
• Analog supply voltage: 1.71 V to 3.6 V
• Independent IOs supply (1.62 V)
• Compact footprint, 2.5 mm x 3 mm x 0.83 mm
• SPI/I2C serial interface data synchronization feature
• Embedded temperature sensor
• ECOPACK®, RoHS and “Green” compliant

The LSM6DS3H is available now in volume production priced at $1.61 in quantities of 1,000 units.