Complete dev platform for intelligent, connected devices: STM32MP255C with NPU/ISP for edge AI, pre-certified Wi‑Fi 6 and Bluetooth 5.4, TSN Ethernet, PCIe, USB 3.0, CAN‑FD — all in a compact 30×30mm SMTplus module.
Digi’s ConnectCore® MP255 Development Kit accelerates prototyping and production for industrial embedded systems that demand edge AI, rich multimedia, and secure connectivity. Built around STMicroelectronics’ STM32MP255C application processor, the SOM adds a Neural Processing Unit (NPU) and Image Signal Processor (ISP) to offload computer‑vision workloads and camera pipelines, enabling responsive in‑situ inference without cloud latency.
Pre‑certified dual‑band Wi‑Fi 6 (tri‑band 6E ready) and Bluetooth 5.4 simplify wireless compliance and cut time to market, while Gigabit Ethernet with Time‑Sensitive Networking (TSN) supports deterministic control loops and synchronized data acquisition across industrial networks. High‑end graphics (3D GPU, VPU encode/decode), high‑resolution MIPI/LVDS/parallel display interfaces, and a MIPI camera port with ISP let you build modern HMIs and vision systems on a single platform. I/O breadth includes PCIe Gen2, USB 3.0, CAN‑FD, and microSD, giving designers headroom for high‑speed peripherals and field buses.
The compact 30×30×3mm SMTplus® form factor and industrial temperature ratings (‑40°C to +85°C) suit space‑constrained and rugged deployments. Digi’s embedded Yocto Linux, TrustFence® security framework, cloud services, and turnkey design support reduce integration effort, harden devices against threats, and streamline fleet management with remote access and OTA updates. Typical applications span edge AI, machine vision, and Industry 4.0 gateways where reliability, deterministic networking, and long‑term availability matter.
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