Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics

April 30, 2019 | 18:00
Microchip announces production release of Silicon Carbide (SiC)  products for high-voltage, reliable power electronics
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology.

 Key Facts:
  • 700V MOSFETs and 700V and 1200V Schottky Barrier Diodes extend customer options
  • Supports growing demand for the efficiency and power density of SiC technology
  • Efficient switching at higher frequencies and offers long-term reliability
  • 20 percent improvement over other SiC diodes in UIS ruggedness test

Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products. These products meet the need to improve system efficiency, robustness and power density in Electric Vehicles (EVs) and other high-power applications in the industrial, aerospace and defence markets.
 
Microchip’s 700V SiC MOSFETs and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC power modules. The over 35 discrete products that have been added to Microchip’s portfolio are available in volume, supported by comprehensive development services, tools and reference designs, and offer outstanding ruggedness proven through rigorous testing. The broad family of SiC die, discretes and power modules are offered across a range of voltage, current ratings and package types.
 
Microchip’s SiC MOSFETs and SBDs offer more efficient switching at higher frequencies and pass ruggedness tests at levels considered critical for guaranteeing long-term reliability. The company’s SiC SBDs perform approximately 20 percent better than other SiC diodes in these Unclamped Inductive Switching (UIS) ruggedness tests that measure how well devices withstand degradation or premature failure under avalanche conditions, which occur when a voltage spike exceeds the device’s breakdown voltage. Microchip’s SiC MOSFETs also outperform alternatives in these ruggedness tests, demonstrating excellent gate oxide shielding and channel integrity with little lifetime degradation in parameters even after 100,000 cycles of Repetitive UIS (RUIS) testing.
Next page 1/2
Loading comments...
related items